Company Profile
EPIC MEMS (Xiamen) Co., Ltd., founded in 2018, is a leading domestic integrated RF chip manufacturer. Headquartered in Xiamen, the company also operates operational and support centers in Shanghai, Shenzhen, and other locations. It possesses China’s most comprehensive in-house full-stack R&D capabilities for advanced BAW+SAW filters, with products covering frequencies from 400 MHz to 7.2 GHz, and has expanded into receiver modules, amplifiers, and customized transmitter modules. With cumulative shipments exceeding 2.2 billion units, its products are widely used in smartphones, IoT, networking, and other fields, and have gained large-scale production validation from major handset brands including Samsung, Xiaomi, Transsion, OPPO, and vivo. The company also supplies standard and innovative products to module manufacturers such as Quectel, Fibocom, Lierda, Neoway, Sunsea, and Foxconn Industrial Internet. In the IoT market, it pioneered dual-duplexer and ultra-compact PAMiD products, helping customers achieve miniaturized multi-function communication modules. The company has been recognized as a National High-Tech Enterprise and a National “Little Giant” Specialized and Sophisticated Enterprise. Committed to technological innovation and industrial synergy, Kaiyuan Communication drives innovation in domestic filter chips and RF modules, serving as the strongest enabler of “communications changing the world.”
Main Business
Filters, Receiver Modules, Amplifiers
Main Products
Description：
Global First Products Based on 8-Inch TC-SAW Process for Dual-Duplexer Integration 1. The EP85013 and EP85058 are innovative dual-duplexer products featuring low insertion loss, high isolation, and low temperature drift. 2. A single 1.6mm × 1.2mm package integrates dual-band duplexer functions for Band 1+3 or Band 5+8, respectively, enabling the functionality of two duplexers within the footprint originally occupied by one. 3.The products are manufactured using SMICs 8-inch TC-SAW large-wafer process, which offers higher production efficiency, superior quality characteristics, and better cost-performance compared to the 4/6-inch processes used by domestic and international competitors. 4.For the first time, the entire value chainfrom wafer processing to final producthas been achieved with original Chinese technology, strongly supporting domestic full-band ultra-compact (10mm × 13mm) LTE modules and miniaturized innovative applications such as wearables.
Description：
Small-package BAW duplexer products supporting 10W high power for satellite communications 1.The EP7765 is a high-performance miniaturized duplexer, built on EPiC’s third-generation SiliBAW technology platform. It supports high-power satellite payload and ground terminal requirements for China SatNet and overseas satellite communication n256 bands. 2.The product utilizes innovative solidly mounted resonator (SMR) technology and enhanced heat dissipation solutions. While maintaining a compact package size (1.6mm × 1.2mm), the measured breakdown power exceeds 10W, and the long-term operating power exceeds 4W. At the same time, it delivers excellent RF performance with insertion loss below 1.5dB and isolation exceeding 65dB. 3.More high-power filter products for additional satellite constellations and frequency bands are under development and promotion. 4.The product characteristics are suitable for emerging application scenarios such as satellite communications, and actual tests have demonstrated improved connection quality for satellite terminal equipment.
Description：
The world’s smallest full-band PAMiD chip for IoT and AI devices 1.EM8643S is the smallest full-band LTE PAMiD RF front-end module for IoT and AI smart devices. 2.The product adopts a 4.0mm × 4.0mm ultra-compact LGA package, integrating duplexers for mainstream bands B1/B3/B5/B8, power amplifiers, antenna switches, and associated matching circuits. 3.It significantly simplifies PCB design and RF tuning. With its revolutionary ultra-highintegration solution, it helps customers accelerate product development and timetomarket, while meeting the miniaturization demands of portable IoT and AI devices. 4.The overseasband expansion version EM8643E and the RedCap derivative EM8643R series are also being promoted to customers simultaneously.