Company Profile
Sequameta Semiconductor Materials Co., Ltd., incubated by the Shenzhen Institute of Advanced Electronic Materials (SIEM), Chinese Academy of Sciences, focuses on the R&D and production of critical materials for advanced semiconductor packaging. The company’s core product portfolio covers Liquid Molding Compound (LMC) for 2.5D/CoWoS packaging, Molding Underfill (MUF) for 3D HBM, Anisotropic Conductive Paste (ACP) for RFID, and Thermal Conductive Gels for 800G+ optical modules. Leveraging over two decades of technical expertise accumulated at SIEM, the company operates fully equipped laboratories for thermal, mechanical, microscopic, and failure analysis, along with a 2.5D/3D wafer-level packaging pilot verification line. It has established an integrated team encompassing R&D, manufacturing, sales, quality inspection, and after-sales service. The company provides rapid custom material development services for customers in the advanced packaging, RFID, and high-speed optical module industries, as well as comprehensive supporting technical solutions.
Main Business
The company’s core product portfolio covers Liquid Molding Compound (LMC) for 2.5D/CoWoS packaging, Molding Underfill (MUF) for 3D HBM, Anisotropic Conductive Paste (ACP) for RFID, and Thermal Conductive Gels for 800G+ optical modules.
Main Products
Anisotropic Conductive Paste(ACP)
Description：
Sequameta’s series of Anisotropic Conductive Pastes (ACP) for RFID has been independently developed in-house. These products exhibit outstanding performance in encapsulation, heat resistance, adhesion, and reliability, and are available in both low-temperature and short-time curing series. They are well compatible with RFID chips of various models, including U9, R6, M7, and M8, as well as a variety of antenna substrates. Additionally, they are fully compatible with leading production equipment from brands such as Muehlbauer, Xin Jing Lu, YTEC, and INFINITECHH.
Technical Specification
Bonding Diagram for M7 & M8 Chips
