Company Profile
ITEC Redefine Semiconductor Manufacturing. We provide industry leading high UPH and accurate pick and place equipment for Semiconductor and RFID industry.
Main Business
ITEC provides innovative, cost effective Epoxy/DAF die bonder, Flip chip bonder, direct die attach Bonder for Semiconductor and RFID assembly.
Main Products
RFID Direct Die Attach Bonder
Description：
- Industry Leading 48K UPH at <27um@3sigma placement accuracy.
- Die size min 0.2mm and Max of 4x4mm with Optional Glue Writing capability
- Capable to handle PET, Paper Inlay
- Full conversion at less than 2.5hrs
- Full Quality control with Vision inspections at critical process points – Glue, Placement, Cure
- Standard Automated Wafer Exchange