
Overview
With the rapid development of scenarios such as smart cities, smart energy, and smart parks, the demand for wide-area, low-power, and highly reliable wireless connectivity continues to grow. As a globally leading open wireless mesh network standard, Wi-SUN, with its open interoperability, native IPv6 support, high security, and large-scale networking capabilities, is accelerating its large-scale deployment in fields such as electric power, water utilities, gas utilities, municipal management, and industrial IoT.
Against the backdrop of the accelerating advancement of AIoT and digital transformation, open standards are becoming an important foundation for collaborative innovation across industries. With the theme “Wide-Area Connectivity, Unlimited Scenarios,” this forum focuses on Wi-SUN open standards, technological evolution, and industrial practices. It brings together experts from the industry ecosystem to discuss technological innovation, ecosystem development, and typical applications, aiming to promote the integrated development of Wi-SUN technology and industry, and jointly foster the prosperity of the wide-area IoT ecosystem.
Organizer
Shenzhen Internet of Things Industry Association,Wi-SUN Alliance
Co-organizers
- Intelligent Communication & Positioning Zone
- Organizing Committee of IOTE International Internet of Things Exhibition
Forum Agenda
| Time | Topic | Conference Subtitle | Speaker / Organization | Title |
| 13:00-13:15 | Registration | – | – | – |
| 13:15-13:20 | Opening | – | Mingtuo Zhou | Chairman of Wi‑SUN Alliance China |
| 13:20-13:40 | Wi-SUN Alliance Report | Wi-Sun Alliance-Overview and Status | Phil Beecher | President & CEO, Wi‑SUN Alliance |
| 13:40-14:00 | Silicon Labs Report | Wi-SUN Connecting the Future: Silicon Labs’ Comprehensive Solutions of Innovation & Practice | Guanrong Li | Principal Engineer of Field Application , Silicon Labs |
| 14:00-14:20 | UnicomSemi Report | New Breakthroughs in Smart IoT: Wi-SUN Mesh Application Practice in Charging Stations & Medical Positioning | Kebo Tong | Senior Marketing Manager, UnicomSemi |
| 14:20-14:40 | GATESEA Report | Dual-Mode Communication Technology Application of Wi-SUN & HPLC | Huorong Liao | East China Sales Director, GateSea |
| 14:40-14:50 | Tea Time | – | – | – |
| 14:50-15:10 | Exegin Report | Exegin Report: FAN 1.0 Network Formation and Re‑Formation | Leslie Mulder | Chairman, Exegine |
| 15:10-15:30 | HOPE MICROELECTRONICS Report | From Long-Range Connectivity to Stable Links & High-Speed Transmission: Evolution Roadmap of Next-Generation Wi‑SUN Chips | Quan Gan | Director of Marketing & Product Management, SHEN ZHEN HOPE MICROELECTRONICS |
| 15:30-15:50 | Friendcom Report | Wi‑SUN FAN 1.1 LE High-Low Power Coexistence Networking Technology, Enabling Hybrid Networking of Diverse Terminal Devices in Power Grids | Wu Hongcheng | Director of Communications R&D, Friendcom |
| 15:50-16:30 | Roundtable Discussion | TBC | Phil Beecher Guanrong Li Kebo Tong Huorong Liao Leslie Mulder Gan Quan Hongcheng Wu Mingtuo Zhou (Moderator) | – |

