On August 27, 2026, Shanghai Fudan Microelectronics Group Co., Ltd. (Fudan Microelectronics, 688385.SH / 01385.HK) held its new product launch event, themed “Empowering Connectivity Through Chips, Building a Fully Connected World,” at IOTE International IoT Exhibition in Shenzhen.
Organized by Fudan Microelectronics and co-organized by Ulink Media, IOTE, and the AIoT Star Map Research Institute, the event explored the opportunities and challenges facing China’s domestic RFID chip industry in the era of Passive IoT.
More than ten new chip products were unveiled across RFID, sensing, and analog front-end technologies. Together, they form an integrated technology portfolio spanning identification, sensing, connectivity, computing, and security, delivering a comprehensive domestic chip solution for applications across apparel and footwear retail, logistics and warehousing, industrial monitoring, healthcare, anti-counterfeiting, and beyond.
Representatives from across the industry value chain, industry associations, and the media gathered to discuss how China’s domestic RFID industry can strengthen its competitiveness and accelerate the development of a self-reliant ecosystem.
01 | Opening Remarks: Passive IoT as a Foundation of the Digital Economy
Yang Weiqi, Executive President of the Shenzhen Internet of Things Industry Association, delivered the opening remarks.
He noted that Passive IoT is a critical foundation for digitizing physical assets and an important part of the infrastructure underpinning the digital economy. After years of development, China’s RFID industry has established a comprehensive supply chain spanning upstream and downstream sectors. However, high-end market segments remain largely dominated by international suppliers, and domestic chip manufacturers still face challenges in technology, ecosystem development, and industry standards.
Yang recognized Fudan Microelectronics’ long-standing commitment to security identification and RF chip technologies. He described the company’s newly launched generation of passive sensing chips as an important step in the evolution of domestic RFID technology — from basic identification to passive sensing.
He also emphasized the Association’s continued commitment to building platforms for industry collaboration and business engagement. By bringing together chip manufacturers, tag producers, system integrators, and end users, the Association aims to strengthen coordination across the value chain. He expressed the hope that more domestic chip innovators like Fudan Microelectronics will continue advancing their technologies, contributing to a stronger homegrown IoT ecosystem and accelerating the large-scale commercialization of Passive IoT.
02 | Industry Insights: Where Are the Opportunities for China’s Domestic RFID Chips?
Next, Zhang Zhongliang, Head of the AIoT XingTu Research Institute, delivered a presentation titled “Opportunities for China’s Domestic RFID Chips in the Era of Passive IoT.”
He observed that, given the current global UHF RFID landscape, it is difficult for domestic chip manufacturers to enter the mainstream overseas ARC-certified market. Instead, they should focus on strengthening their presence in China and exploring overseas markets where ARC certification is not the primary market requirement.
He identified apparel and footwear retail, express delivery and logistics, healthcare SPD (Supply, Processing and Distribution), and industrial manufacturing as major growth opportunities in China. Demand for specialized RFID tags is also continuing to rise, making these application segments key markets for domestic chip manufacturers seeking to strengthen their competitive position.
03 | New Product Portfolio: More Than Ten New Chips Unveiled
Wang Lei, Deputy General Manager of the Security and Identification Business Division at Fudan Microelectronics, then delivered a presentation titled “Empowering Connectivity Through Chips, Building a Fully Connected World: Fudan Microelectronics’ Commitment to the RFID Ecosystem.”
He introduced the company’s latest product portfolio, featuring more than ten new chips across several categories, including UHF reader SoCs, general-purpose UHF tag chips, passive sensing tag chips, NFC products, a continuous glucose monitoring (CGM) analog front end, and a 2.4 GHz RF SoC.
UHF Reader Chips
The third-generation high-performance reader SoC, FM13RD1618 (RD1618), made its debut. The chip integrates an MCU, RF transceiver, security algorithms, and LPTD low-power detection into a single device.
Compared with its predecessor, it delivers significantly improved receiver sensitivity, reaching -102 dBm in M8 80K mode. It supports SM7 and AES security algorithms while substantially reducing operating power consumption.
In testing, its inventory performance in dense-tag environments outperformed competing products. The chip supports PRASK and DSB-ASK modulation, features an integrated balun, and requires fewer external components. These features help equipment manufacturers reduce BOM costs and upgrade to a single-chip reader solution.
Target applications include warehouse inventory management, smart door locks, elevator identification, and other RFID-enabled systems.
Also introduced was the high-performance fixed reader FM8309H04G, which supports multiple antenna ports and high-speed bulk tag reading. It is designed for large-scale automated inventory applications in warehouses and logistics facilities.
UHF Tag Chips
Fudan Microelectronics also announced a major upgrade to its UHF tag chip portfolio.
The second-generation general-purpose UHF tag chip, UF52A, has obtained official GS1 certification. Compared with the previous generation, it offers a 60% increase in bandwidth and improved receiver sensitivity, helping reduce interference in complex environments and suppress ghost-tag occurrences.
The chip also delivers improvements in encoding, anti-collision performance, consistency, and mass-production reliability. Its RF port is directly compatible with previous-generation antenna designs, helping customers minimize upgrade costs.
UF52A is designed for large-scale commercial deployment across apparel and footwear, logistics, and retail applications.
Passive Sensing Tags
To address the growing demand for passive sensing in IoT applications, Fudan Microelectronics introduced several passive sensing tag chips:
- UM52C – A passive UHF tag chip with capacitance measurement capabilities.
- UF52L – A passive tag chip supporting LED-based visual location.
- UF52T – A passive tag chip for open/closed state detection.
Among them, the UM52C supports a measurement range of 0–2,000 pF, with resolution reaching 10 fF. Operating without a battery, it enables passive measurement of physical parameters in applications such as bolt-tightness monitoring, soil moisture detection, and water-leak detection.
Under typical test conditions, UF52L can illuminate an LED at a distance of up to 3 meters, providing a visual indication to help locate tagged objects.
UF52T supports long-range, battery-free detection of open and closed states, offering a lightweight solution for industrial equipment inspection and condition monitoring.
The company also unveiled the high-frequency capacitive sensing tag HM02C. Compatible with direct NFC smartphone reading, it can provide liquid-level and humidity information, extending the application potential of passive sensing across both consumer and industrial markets.
NFC Product Portfolio
Fudan Microelectronics also announced several advances across its NFC product line.
The next-generation NFC reader controllers, FM19700/FM19701, build on the company’s established position in China’s NFC reader chip market. They support EMVCo financial transactions and multiple NFC tag protocols, with a complete DEMO development kit available to support product development.
The FM19511/19512 BoostTag chips feature integrated RF boost amplification. They address weak NFC communication in compact devices and metal-shielded environments, improving reading distance and communication stability under challenging conditions.
The FM11NS082 is a high-capacity secure NFC tag chip supporting AES encryption. It enables smartphone-based authentication and product traceability through a simple tap, without requiring a dedicated app, making it suitable for brand protection and anti-counterfeiting applications.
The dual-interface tag chips FM11NT161V/FM11NT321V provide large-capacity memory of 16 Kbit and 32 Kbit, respectively. They are designed for offline parameter configuration and data logging in applications such as smart lighting and intelligent metering.
The RF08 series of logic-encryption chips has also been upgraded to GEN3 FM11RF08SE, offering enhanced resistance to security attacks while maintaining strong compatibility. The series serves high-volume markets including consumables and identity identification.
Healthcare and Low-Power Smart Devices
The launch also featured products designed for wearable healthcare and low-power intelligent devices.
The FM44FE131GS is an analog front-end chip for continuous glucose monitoring (CGM) applications. It features a high-precision 16-bit ADC and a resolution of 0.8 pA, enabling the acquisition of extremely weak electrochemical signals in the pA and nA ranges.
With ultra-low power consumption and a compact package, the chip is designed to support the rapidly developing domestic CGM industry.
The FM13MG6201, a 2.4 GHz RF SoC, integrates RF, NFC, and temperature-sensing functions. It targets low-power smart devices such as electronic shelf labels, tracking devices, and CGM terminals.
04 | Full-Stack Capabilities: Building a Self-Reliant Passive IoT Ecosystem
According to Fudan Microelectronics’ Security and Identification Business Division, RFID technology is evolving beyond basic ID identification toward a new stage defined by passive operation, sensing, and security.
Drawing on its integrated capabilities in identification, sensing, connectivity, computing, and security, Fudan Microelectronics is committed to advancing domestically developed technologies. The company continues to refine its reader, tag, and sensor chip portfolios while providing comprehensive hardware DEMOs, SDK software packages, and a wide range of application examples.
These development resources are designed to lower the technical barriers for industry partners and help downstream customers accelerate product development and commercialization.
The launch marks an important upgrade to Fudan Microelectronics’ comprehensive chip portfolio for Passive IoT. Looking ahead, the company will continue to strengthen collaboration between industry, academia, and research institutions, while developing RF and sensing chips for diverse markets in China and around the world.
By working closely with tag manufacturers, equipment providers, and system integrators, Fudan Microelectronics aims to build a self-reliant and controllable Passive IoT ecosystem, supporting digital transformation across a wide range of industries.