IOTE Expo China

IOTE 2024 | The 22nd International Internet of Things Exhibition-Shenzhen

2024.08.28-30
Shenzhen World Exhibition & Convention Center (Bao'an District)

[IOTE Expo 2024 Shenzhen]Powering a New Future in Digital Packaging with Flexible Integrated Circuit Technology

2024-08-30

On August 28, during the IOTE 2024 Shenzhen RFID Passive IoT Ecosystem Symposium, Jinjia Group officially announced a strategic collaboration agreement with Pragmatic Semiconductor, a global leader in ultra-low-cost flexible integrated circuit (FlexIC) design and manufacturing. The agreement marks the intention of the companies to work in the areas of RFID flexible integrated circuits (FlexICs), electronic tags and digital packaging, bringing new levels of innovation to the digital packaging sector.

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b1e0f61a1df41c6f9d38d9d109afccec.jpgJinjia Group, plans to integrate Pragmatic’s FlexIC technology into its offering, leveraging its extensive technical expertise, broad market resources and significant industry experience in electronic tags and digital packaging. During the strategic collaboration agreement signing ceremony, hosted at the trade show IOTE Shenzhen, Qiao Luyu, Secretary of the Party Committee and Chairman of Jinjia Group, delivered a speech emphasizing that Jinjia and Pragmatic are collaborating and also have a shared vision to create a more sustainable, innovative future, offering item-level intelligence,through smart packaging to applications and products previously unconnected, contributing to the circular economy and driving digital transformation to bring an interconnected world closer to reality.

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David Moore, CEO, Pragmatic Semiconductor said “We are delighted to be working with Jinjia Group to extend access to our FlexIC technology, through smart packaging at scale, across its value chain and expansive customer base. Our mission is to connect the unconnected via our sustainable, innovative FlexIC products, expanding the ecosystem to reach a cross section of vertical industries. Smart packaging represents a tremendous opportunity to drive more sustainable practices and behaviors, which in turn fuel further innovations, contributing to net zero goals. We look forward to seeing future smart packaging innovations in market.”

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The signing of this agreement marks a new phase in the long-term strategic cooperation between the two companies, establishing a solid foundation. Jinjia Group has also placed an order to access to Pragmatic’s FlexIC technology and will also receive technical support to develop it’s first "RFID-NFC" smart packaging product. By integrating Pragmatic's FlexIC technology into it’s high-quality online assembly packaging, it aims to significantly enhance product interactivity and consumer user experiences, building brand preference and loyalty, encouraging widespread global consumer participation and driving the digital packaging industry to new heights in China and globally.

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The establishment of this strategic collaboration represents a significant decision based on shared vision and strategic objectives. Through the joint efforts and relentless pursuit, both will achieve even greater accomplishments in the integration and innovation of flexible chip technology and digital packaging!

 

This paper is from Ulink Media, Shenzhen, China, the organizer of IOTE EXPO (IoT Expo in China)

Join us at August 28–30 in Shenzhen, and let’s shape the future of technology together!

To register IOTE 2024 Shenzhen station:

https://eng.iotexpo.com.cn/sz/Visitors.html?lang=EN&source=YJ1


IOTE 2024 The22nd International Internet of Things Exhibition-Shenzhen 2024.08.28-30 Wed. To Fri. 9:00-17:00(only Friday until 14:00)

IOTE EXPO SHENZHEN LOCATION-Shenzhen World Exhibition Center (Bao'an District)
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