On November 15, 2023, ITEC, based in Nijmegen, the Netherlands, officially unveiled the groundbreaking ADAT3 XF Tagliner, setting a new benchmark for speed and precision in the embedded pick-and-place machine sector. This pick-and-place machine boasts an impressive placement speed of 48,000 components per hour, surpassing its counterparts. Its positional and rotational accuracy reaches unprecedented levels in the industry, exceeding 9 micrometers and 0.67°, respectively. Compared to similar devices, it achieves a threefold speed increase and a 30% improvement in accuracy at 1 Sigma.
The ADAT3 XF Tagliner achieves full automation, standing out with a yield rate exceeding 99.5%. It presents a lower Total Cost of Ownership (TCOO) compared to similar devices, providing manufacturers with a significant competitive advantage. Furthermore, this pick-and-place machine opens up new possibilities in emerging RFID application areas, including retail, automotive labels, access control, train tickets, airline baggage tags, and containers.
As a leader in the semiconductor industry, RFID technology inherently belongs to the semiconductor technology domain. ITEC brings over 30 years of rich experience in the semiconductor field, having successfully installed hundreds of systems similar to semiconductor chip placement in other markets. The ADAT3 XF Tagliner features standard functionalities required by the semiconductor industry, such as automatic wafer exchange for 8-inch and 12-inch wafers and multiple high-resolution cameras for quality control before and after each process step.
This pick-and-place machine utilizes a high-precision adhesive curing system, employing only two thermal electrodes, reducing moving parts for enhanced reliability and maintainability. With a curing time of just 65 milliseconds — two orders of magnitude lower than other RFID pick-and-place machines — it significantly improves operational efficiency.
The ADAT3 XF Tagliner supports various transparent and non-transparent reel materials, offering a substantial advantage over traditional RFID pick-and-place devices limited to transparent materials. The system integrates BW Papersystems winders and Voyantic readers, accommodating the use of emerging substrate materials (such as paper gradually replacing PET plastic). Even with a tape pitch of up to 50.8 millimeters, it maintains an outstanding speed of 48,000 UPH.
This article was originally published by Ulink Media, the organizer of IOTE EXPO (IoT Expo in China).
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