According to recent news, Telink Semiconductor's latest TL7000 series chips adopt multi-core or high-processing single-core design, with the characteristics of high computing power, low power consumption and high flexibility, which can meet some requirements of edge AI/ML computing, especially in local voice recognition, neural network noise reduction, industrial sensor data fusion, abnormal monitoring, health sensor signal processing and other aspects.
Telink Semiconductor believes that in the field of Internet of Things, the overseas market is larger than the domestic market. It is reported that its company has been actively deploying overseas and making efforts in overseas markets.
Telink Semiconductor's 2024 third quarter report shows that the company's total operating income reached 587 million yuan, an increase of 23.34% year-on-year, and the net profit attributable to the parent was 64.2713 million yuan, a significant increase of 71.01% year-on-year, and the gross profit margin was as high as 47.9%. From the data of a single quarter, the total operating income in the third quarter was 222 million yuan, a year-on-year increase of 40.91%, and the net profit attributable to the parent increased by 315.63%, reaching 37.2873 million yuan.
In my opinion, the performance growth is mainly due to the increase in the market demand for low-power wireless IoT chips. At the same time, the company actively explores domestic and foreign markets, increases customer investment and technical support, and carries out diversified downstream application market layout. In addition, Telink Semiconductor has also improved gross profit margin and net profit margin by strengthening supply chain management and optimizing costs, achieving higher profitability.
According to Xinsensor, Telink Semiconductor's overseas team is currently about 50 people, and its overseas business layout is mainly in Europe and the United States. The company's main international peers in the industry include Nordic, Silicon Labs, Dialog, TI and NXP, and the global low-power Bluetooth market is expected to be around US$2 billion.
Telink Semiconductor expects that the company's audio products will have good growth this year, and the new generation of audio chips will have significant improvements in power consumption and performance. The company will focus on its main business and seek suitable external development opportunities.
According to market research, the global audio chip and module market size continues to grow, and is expected to maintain a stable annual compound growth rate in the next few years. This growth is mainly due to the popularization and upgrading of consumer electronics products and the rapid development of IoT technology.
What is the development trend of the new generation of audio chips?
Smaller and more powerful chip design: With the advancement of technology, audio chips will become smaller but more powerful. The continuous improvement of chip design process and the increase of integration will enable audio chips to achieve more functions in a smaller volume and provide higher quality audio processing capabilities.
Integration with deep learning and artificial intelligence: By integrating deep learning algorithms and artificial intelligence technology, audio chips can better understand and process sound signals, achieve more accurate speech recognition, semantic understanding and emotion recognition, and provide users with a more intelligent experience.
Personalized audio experience: Through intelligent algorithms and data analysis, audio chips can achieve intelligent sound effect adjustment and personalized audio output according to user preferences and needs, so that everyone can get the most suitable audio experience for themselves.
Improved audio transmission quality: With the development of wireless communication technology, audio chips can achieve more stable and low-latency audio transmission, providing users with a better wireless audio experience.
Wide application in emerging fields: For example, in virtual reality (VR) and augmented reality (AR) technologies, audio chips can be used to achieve more realistic and immersive audio effects; in the field of smart home and Internet of Things, audio chips can be used in devices such as smart speakers, smart door locks and smart appliances to achieve more intelligent audio control and interaction.
This paper is from Ulink Media, Shenzhen, China, the organizer of IOTE EXPO (IoT Expo in China)
