Recently, Shanghai Yusi Microelectronics Co., Ltd. (hereinafter referred to as "Yusi Microelectronics"), which focuses on high-end image processing and video transmission chips, successfully completed the Pre-A round of financing. This round of financing was led by Longding Investment, and it also received joint investment from many well-known institutions such as Shenzhen Smart City Industrial Investment Fund, Qihang Tongxin, Aixisheng Technology, Zhuoyuan Asia, Duyi Fund, and Xinyu Jiahua.
Yusi Microelectronics was established in Lingang, Shanghai in 2021. It is a company focusing on core image processing algorithms and high-speed video transmission technology. Its core team is composed of senior backbone experts from well-known companies such as Huawei, Qualcomm, and Hisense, with more than 18 years of experience in image chips and communications. The company's core products include ISP and Serdes two-in-one chips, as well as ISP, Serdes and CIS three-in-one chips.
Mr. Nie Zhongping, founder and CEO of Yusi Microelectronics, has served as Hisense chip design director, Huawei chip expert, and senior chief engineer at Pixel Technology in the United States. He has more than 20 years of experience in chip design and mass production. Mr. Zhao Shoulei, co-founder and CTO, was formerly the chip design manager of Hisense and the chief algorithm engineer of Qualcomm Shanghai R&D Center, responsible for the design of Qualcomm mobile phone chip image system. Mr. Shao Ming, chief architect, was formerly a senior engineer and algorithm design expert of Qualcomm Japan, responsible for the algorithm and architecture design of the Snapdragon chip image processing display subsystem, and led the optimization of Qualcomm video codec algorithm and proposed the super-resolution enhancement algorithm.
More than 20% of the core team members of Yusi Microelectronics have more than 20 years of experience in image chips and communications, and nearly 80% of the members have a master's degree or above. The company currently has a total of about 30 people, of which more than 90% are R&D personnel. The team as a whole has accumulated more than 20 years of experience in the image field, and has gone through multiple rounds of algorithm design, chip architecture design, tape-out, verification, algorithm iteration upgrade and tape-out again.
Mr. Nie Zhongping said: "Image processing and transmission technology is in a stage of change. With the exponential growth of data volume and strict requirements for data security, ISP pre-fusion computing has become the future development trend. Driven by domestic chip substitution, the demand for related chips and products will continue to grow, especially in the automotive field. It is estimated that by 2025, the market demand for domestic automotive image chips will reach about 500 million, and the market size is expected to exceed 10 billion yuan."
This paper is from Ulink Media, Shenzhen, China, the organizer of IOTE EXPO (IoT Expo in China)
