IOTE 2025, the 23rd International Internet of Things Exhibition Shanghai, will be held in Shanghai New International Expo Center from June 18 to 20, 2025. This time, it will join hands with MWC Shanghai to write a new chapter in the Internet of Things and mobile communications!
IOTSWC Exhibition
Kigen (UK) Limited
Booth No.: N5C40
Fira Gran Via, Barcelona, Spain
May 13-15, 2025
Meet you at the Barcelona Global Event
Company Profile
Kigen is the forerunner in eSIM and integrated SIM (iSIM) security-enabled IoT solutions built for scale. An Arm-founded company, Kigen flexibly empowers OEMs with the digital delivery of the secure iSIM package for out-of-the-box LPWAN connectivity from 250+ leading network providers worldwide on the most trusted IoT chipsets and modules. As a pioneer of iSIM technology, our products and partnerships are behind some of the most innovative solutions transforming logistics, smart metering and energy, industrial automation and more. Our industry-leading SIM OS products enable over 2.5 billion SIMs and complement our GSMA SAS-accredited Remote SIM Provisioning secure service capabilities. Find out more at kigen.com or join our #FutureofSIM conversation on LinkedIn.
Product Introduction
eSIM OS
Kigen eSIM OS is the world's leading eSIM OS, built for OEMs and MNOs, addressing both Consumer and Industrial IoT/M2M，two core markets. For consumer devices (e.g., smartphones, wearables), its groundbreaking architecture aligns with the latest SGP.32 standards, enabling flexible profile switching and secure provisioning within manufacturing with out-of-the-box user experience. In industrial M2M applications (e.g., smart metering, logistics tracking), the system delivers ultra-low-power consumption, high durability, and extended operational lifespan requirements, natively supporting LTE-M/NB-IoT low-power protocol stacks.
Kigen eSIM OS provides end-to-end security from chip-level protection to cloud-based key management, offering seamless scalability from Consumer eSIM to industrial iSIM implementations.
Kigen eIM Solution
Kigen eIM is the world’s first fully validated next-generation IoT eSIM remote manager compliant with GSMA SGP.32. Purpose-built for low-power devices, it supports full eSIM lifecycle management, including activation, deactivation, and updates. Innovative features such as instant fallback and lossless connectivity, indirect profile deployment, and in-factory provisioning allow to open up the barriers of traditional SM-DP+ integration for global cellular IoT. Kigen’s unique eIM solution, compliant to GSMA SAS-UP security is available now for anyone starting design with eSIMs – for any device, for any standard and works with any SM-DP+. Enabling developers with an embedded C library, C-SDK, and centralized management via the Kigen Pulse platform, it comprehensively supports all Remote SIM Provisioning (RSP) capabilities, empowering efficient operation of devices requiring long battery life.
In-Factory Profile Provisioning
Kigen’s IFPP (In-Factory Profile Provisioning) is an efficient alternative to field provisioning, ideal for devices using LPWAN technologies such as NB-IoT , devices dependent on single charge batteries in field operations as well as any device for which connectivity is mission-critical. It addresses the greatest bottleneck for cellular and removes the traditional SIM logistics, bringing secure provisioning digitally into your manufacturing within minutes. It enables secure pre-configuration of eSIMs before shipment, with one or more MNO profiles based on geographic location, enabling out-of-the-box connectivity. IFPP supports dynamic profile updates during manufacturing, streamlines production processes, reduces SKU complexity, and accelerates large-scale deployments—especially for IoT devices with limited battery life. This solution significantly enhances manufacturing efficiency and scalability for OEMs and serves as a key extension of GSMA’s Remote SIM Provisioning (RSP) and can be adjusted for online or offline manufacturing setups to maximize your quality and throughput.
