Company Name:晶丰全邦科技(上海)有限公司
Company English Name:EPM Technology(Shanghai) Industrial. Co.,Ltd
Booth Number:1A130
Tel.:
Addr.:上海市嘉定区南翔镇惠平路801号1号楼1202室
WebSite:
Chinese Introduction:
晶丰全邦科技(EPM-Chanbond)创建于2007年,总部设立于中国武汉,并在美国圣地亚哥设有研发实验室。晶丰全邦是行业领先的高分子粘合剂材料供应商,依托行业十多年的发展经验,在通信、微芯片级封装、消费电子、CMOS、RFID、LED显示照明等领域积累了大量的行业领先经验,以不断的研发投入及技术创新、丰富的商业渠道,服务全球市场客户。
English Introduction:
Founded in 2007, EPM-Chanbond Technology (Shanghai) Industrial Co.,Ltd (EPM-Chanbond) is headquartered in Wuhan, China and owned an advanced R&D laboratory in San Diego, USA. EPM-Chanbond is a leading supplier of polymer adhesive materials in the industry. Based on more than 10 years of development history in the industry,we have accumulated sufficient experience in the fields of communication, microchip encapsulation, consumer electronics, CMOS, RFID, LED display lighting and etc. At the same time, we provide services to customers in global market with continuous research & development investment, technology innovation and rich support of agencies.

Venue
Shenzhen Convention & Exhibition Center, Hall 1, 2 ,4
Fuhua Third Road,Futian District,
Shenzhen, Guangdong, China

Date
Wednesday August 18, 2021 9:00am-5:00pm
Thursday August 19, 2021 9:00am-5:00pm
Friday August 20, 2021 9:00am-3:00pm

Contact Us
For event inquiries,
email ll@ulinkmedia.cn
or call 0755-86227155

Book a Hotel
Exclusive discounted rates on hotel rooms in the local area are available to attendees>>Here

If you have any questions, please contact
E-mail: ll@ulinkmedia.cn WhatsApp&Skype:13266868052