ON Semiconductor will join 2018 The 10th International Internet of Things Exhibition (Summer Fair) from July 31 to Aug 2 with their latest bar code thermal printers of the Company. The booth number is 9C82-2.
ON Semiconductor is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company's products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
ON Semiconductor can provide a comprehensive portfolio of energy efficient solutions, help customers solve their unique design challenges, empower design engineers to reduce global energy use, operate a responsive, reliable world-class supply chain and quality program and maintain global environmental sustainability and social responsibility programs.
ON Semiconductor’s temperature sensing family of Smart Passive Sensors are UHF RFID wireless sensors that allow the passive sensing of temperature in a variety of applications where size and accessibility is at a premium.
The temperature sensor tag is specifically designed for the passive sensing of temperature on ceramic surfaces. The tag digitizes sensed temperature information which can be read by a standard UHF RFID Gen 2 compliant reader. This Smart Passive Sensor offers many benefits for deployment in industrial preventative maintenance settings.
Single IC, Smart Passive Sensing
Small Form Factor Packages
On-ceramic Temperature Sensing
On-chip RSSI Sensor
64 bit TID and 128 bit EPC + 192 Bit User Defined Memory
EPC Class 1 Gen 2 v.2.0.1 ISO 18 000−6C Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
Industrial Predictive Maintenance
RSL10 is a Bluetooth 5 certified, multi-protocol radio System on Chip (SoC) which brings ultra-low-power wireless technology to wireless applications.
Offering the industry’s lowest power consumption, RSL10 helps provide devices like heart rate monitors with advanced wireless features while optimizing system size and battery life.
Unlike most other multi-protocol radio SoCs, RSL10 is specifically designed for applications using 1.2 and 1.5 V batteries, and supports a voltage supply range between 1.1 and 3.3 V without a required DC/DC converter. The highly-integrated radio SoC features a dual-core architecture and a 2.4 GHz transceiver, providing the flexibility to support Bluetooth low energy technology and 2.4 GHz proprietary or custom protocols.
- Industry's lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW)
- Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V)
Advanced Multi-Protocol Wireless Functionality:
- Rx Sensitivity: -94 dBM
- Transmitting Power: -17 to +6 dBm
- Supports Bluetooth low energy and 2.4 GHz proprietary/custom protocols
- Supports Firmware Over The Air (FOTA)
Flexible Voltage Supply Range (1.1 and 3.3 V):
Supports devices using 1.2 and 1.5 V batteries without a required external DC/DC converter
RSL10 is offered in a 5.50 mm2 WLCSP and a 6 x 6 mm QFN. For added miniaturization, the radio SoC can be integrated into System-in-Package (SiP) solutions which combine RSL10 with a custom ASIC.
Sophisticated Dual-Core Architecture: Features a programmable ARM Cortex-M3 processor for clocking speeds up to 48 MHz and the flexibility to support 2.4 GHz proprietary and custom protocol stacks. An embedded Digital Signal Processor (DSP) enables signal processing intensive applications, such as wireless audio codecs.
On-Chip and Software Wireless Support: Features a 2.4 GHz Radio Frequency Front-End (RFFE) and a Bluetooth 5 certified baseband controller which supports 2 Mbps data rates. A wide range of supported Bluetooth low energy protocols are provided in the RSL10 development tools kit.
Highly-Integrated System-on-Chip (SoC): The powerful dual-core architecture is complemented by high-efficiency power management units, oscillators, flash, and RAM memories, a DMA controller, and peripherals and interfaces.
Other Key Technical Features:
- 384 kB of flash memory
- IP protection feature to secure flash contents
- Configurable analog and digital sensor interfaces (GPIOs, LSADs, I2C, SPI, PCM)
IoT Edge-Node Applications
Bluetooth Low Energy Technology
It is reported that 2018 (10th) China International Internet of Thing Exhibition hosted by China Internet of Things Industry Application Alliance. It showcases the whole IoT industry chain, covers perceptual layer, network layer and intelligent application layer of IoT. It exhibits the technologies of RFID, sensor network, short-range communication, financial mobile payment, middle-ware, big data processing, Cloud, real-time locating, and etc; It also shows the IoT solutions and applications in various industries, such as transportation, manufacturing, smart grid, smart home, logistics, anti-counterfeiting, attendance, military, asset management, apparel, library, smart city, environment monitoring. It is the largest and most comprehensive internet of things exhibition in Asia. This exhibition expected to more than 50,000 square meters in area, 700+ exhibitors, 100000+ buyers and visitors. Welcome to the exhibition and have more communication with exhibitors! We except your participation！
Date: July 31- Aug 2, 2018
Venue: Shenzhen Convention & Exhibition Center, Hall 1, Hall 6, Hall 9
Register for IoTE 2018 Free Ticket: http://eng.iotexpo.com.cn/IOTUApply.aspx#txtCName